Products
Features
• Isolation voltage 3kV
• Leakage < 30pA @ 3kV typical
• Guarded relay matrix and connectors, optional Kelvin guarding (force/sense)
• Discharge feature
• Up to 12 inputs x 12 outputs, optional expansion units for additional 12 outputs each
Applications
• Semiconductor characterization
• Research & science laboratories
• Any combination of input and output connectors, e.g. Keysight HV triaxial, Tektronix HV
triaxial, SHV, BNC triaxial (500V), special high voltage 12x connector & cable
• Software-compatible to standard products
Package Level Reliability Test System
Features
• Oxide integrity and transistor test (TDDB, BTI, HCI)
• High capacity: Up to 128 devices in 16 stress groups
• ±200V stress and characterization voltage (±400V mode w/ half test capacity)
• TDDB testing w/o coincident failures: One stress source for each DUT
• High power source measure units for transistor stress and characterization
• Optional switch matrix: Free assignment of package pins
• Optional high speed ADC: 1us timing resolution
• Reliable and low noise: No cables or board connectors in oven chamber
• Temperature range: 80°C to 250°C (optional 20°C to 250°C
Applications
• For assembled devices
• High capacity
• Optimized for HC, TDDB, NBTI
Features
• CMOS and Bipolar Transistors
• 10 μV to 200 V (300 V), 1 pA to 400 mA (1 A)
• Very Flexible Configuration: 2 to 5 Terminal Devices
• High Capacity: 256 DUTs, 16 Groups
• High Speed: 100 Measurements/s
• High Accuracy: 0.05% Base Accuracy
• Various Temperature Options
Applications
• Characterization of complex devices
like fully isolated high voltage transistors
with up to five terminals using all different voltages